Liquid Cold Plate

In case you do not find the type or model in the website We can customized according to your request.
Contact Now

TEL:0086-21-35324169
FAX:0086-21-35324166
Email:sales@shenglintec.com
WhatsApp:0086 13916147965
Mob:0086 13916147965

Features
Technical Data
Application
Certification
Part List
Reference

Introduction

Liquid cooling plates are devices used for heat dissipation and offer advantages such as high efficiency, energy savings, and low noise.

Liquid cooling plates utilize fluid, typically water or other coolant, to conduct and cool high temperature components. They are usually made of metal and have numerous small channels through which the cooling liquid can flow and absorb heat, which is then carried away by a circulating system. This technology is widely used in electronic devices, computer chips, lasers, and other high-power equipment that require heat dissipation, effectively reducing temperatures and improving performance and lifespan of the equipment.

Liquid cooling plates offer several advantages over traditional air cooling systems

· High heat dissipation efficiency : Direct contact high-temperature components. Liquid have higher thermal conductivity and heat capacity.
· Space utilization : Plates can closely conform to the surface of high temperature components without being limited by airflow.
· Customizable design : Meet specific application requirements, such as shape, size, and number of channels, to adapt to different equipment and product cooling needs.
· Energy-efficient and eco-friendly : Offer higher heat dissipation efficiency, reducing energy consumption and minimizing environmental impact.

Intel CPU Dual Channel Heat Source: Eagle Stream CPU Heat Dissipation: 350W2 Material: Copper Alloy Process: TLP Welding Working Fluid: 25%Propylene Glycol Pressure Drop: 6kPa@1LPM Cold Plate Dimensions: 11878*16.5mm Application Field: Server/Workstation CPU	Intel CPU Liquid Cold Plate Heat Source: Eagle Stream CPU Heat Dissipation: 350W2 Material: Copper Alloy Process: TLP Welding Working Fluid: 25% Propylene Glycol Pressure Drop 16kPa@1LPM Cold Plate Dimensions: 11878*10mm Application Field: Server/Workstation CPU	AMD CPU Liquid Cold Plate Heat Source: AMD SP5 CPU Heat Dissipation: 500W2 Material: Copper Alloy Process: TLP Welding Working Fluid: 25% Ethylene Glycol Pressure Drop: 44kPa@2LPM Cold Plate Dimensions: 11692*18mm Application Field: Server/Workstation CPU

Nvidia GPU A100/A800 Name: A100/A800 Single Slot Liquid Cold Plate Heat Source: Nvidia A100/A800 GPU Heat Dissipation: 300W Material: Aluminum alloy Process: Friction Stir Welding Coolant: 57% Ethylene Glycol Water Solution Pressure Drop: 8.5kPa@1.5LPM Dimensions: 420mm100mm20mm Application: Server/Workstation Graphics Card	Nvidia GPU A6000 Name: A6000 Single Slot Liquid Cold Plate Heat Source: Nvidia A6000 GPU Heat Dissipation: 300W Material: Copper/Aluminum alloy Process: TLP Welding Coolant: 34% Ethylene Glycol Water Solution Pressure Drop: 2kPa@1LPM Dimensions: 266.8mm98mm19.5mm Application: Server/Workstation Graphics Card	Nvidia CPU H100/H800 Name: H100/H800 Liquid Cold Plate Heat Source: Nvidia H100/H800 GPU Heat Dissipation: 700W Material: Pure Copper + Aluminum Alloy Frame Process: TLP Welding

Nvidia GPU 4090 Name: 4090 Single Slot Liquid Cold Plate Heat Source: Nvidia 4090 GPU Heat Dissipation: 450W Material: Pure Copper + Aluminum Alloy Frame Process: TLP Welding Coolant: 20% Propylene Glycol Water Solution Pressure Drop: 8kPa@0.5LPM	Nvidia GPU 3080 Name: 3080 Dual Slot Liquid Cold Plate Heat Source: Nvidia 3080 GPU Heat Dissipation: 368W Material: Pure Copper + Aluminum Alloy Frame Process: TLP Welding Coolant: 30% Ethylene Glycol Water Solution Pressure Drop: 4kPa@1LPM	Nvidia GPU 4060 Name: 4090 Dual Slot Liquid Cold Plate Heat Source: Nvidia 4090 GPU Heat Dissipation: 450W Material: Pure Copper + Aluminum Alloy Frame Process: TLP Welding Coolant: 34% Ethylene Glycol Water Solution Pressure Drop: 2.5kPa@1LPM